Classes offered by faculty of Nano-Optics and Optoelectronics Research Laboratory
image
image
image


MIC636 Advanced Micro And Nanofabrication Of Microsystems Devices

Instructor: Dr. Jamie Viegas
Pre-requisites: MIC501 Micro/Nano Processing Technology, or previous experience in microdevices fabrication; MIC630 Fundamentals of Photonics or equivalent.
Next time offered:  Fall 2013


Brief Description:

The state of the art in the microsystems device fabrication will be covered, from standard CMOS processes to niche advanced prototyping techniques of usage in new areas as photonics, MEMS, OMEMS, thin-film FETs and biosensors. Non-standard techniques such as pick-and-place, nanostructure self-assembly and holographic lithography will also be covered.


Lecture schedule, by week:

Week 1: Introduction and overview; course description and structure. Safety and contamination issues in a cleanroom. Overview of cleanroom hazards.
Week 2: Process design. Basic process flow structuring. Wafer type selection and cleaning methods. Additive fabrication processes. Material deposition methods.
Week 3: Overview of physical vapor deposition methods (thermal, e-beam, molecular beam evaporation) and chemical vapor deposition methods (PE-CVD, MOCVD, CBE, ALD).
Week 4: Pulsed laser deposition (PLD), pulsed electron deposition (PED). Doping: diffusion and ion implant techniques
Week 5: Spin-coating, Spray-coating. Planarizing coatings. Sol-gel derived coatings. Pick-and-place material deposition. Deposition over topography.
Week 6: Lithography: e-beam lithography, contact lithography, stepper lithography.
Week 7: Lithography: holographic lithography, direct-laser writing. Lithography enhancement methods and lithography modeling.
Week 8: Mid-Term Break
Week 9: Etching: wet etching, isotropic and anisotropic.
Week 10: Etching: reactive ion etching (RIE) and inductive coupling plasma etching (ICP)
Week 11: Etching:Deep reactive ion etching (DRIE). The Bosch process. Through silicon vias. Isotropic release etch.
Week 12: Chemical-mechanical polishing (CMP), lapping and polishing.
Week 13: Protective encapsulating materials and their deposition. Wafer dicing, scribing and cleaving. Mechanical scribing and laser scribing.
Week 14: Wafer bonding, die-bonding. Singularization of bonded wafers. Wire bonding, die-bonding. Chip-mounting techniques.
Week 15: Self-assembling semiconductor nanostructures.
Week 16: Final Exam

Course Grading:
  • 15% Homework
  • 15% Mid-Term Exams
  • 45% Course Project
  • 25% Final exam

Out-of class assignments
  • Ten homework assignments, each due at the end of the week following its assignment date.
  • The simulation and actual fabrication of a device in the cleanroom.

Course Materials
Textbooks
  • Madou M., Fundamentals of Microfabrication and Nanotechnology, Third Edition, Three-Volume Set, CRC-Press, 2011. ISBN: 978-0849331800| Edition 3
Recommended Readings
  • Cui, Z., Nanofabrication: principles, capabilities and limits. Springer, 2010.
  • Henini, M., Handbook of Self Assembled Semiconductor Nanostructures for novel devices in Photonics and Electronics, Elsevier 2008.
  • Current papers from established international journals, pin-pointing the most recent advances in fabrication technology.
image


image
image
image